Abdul Hamid Bin Yousuf
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
1
Active years
2015–2017
Best venue rank
C
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2017 | ISCAS | Impacts of different shapes of through-silicon-via core on 3D IC performance. | Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury |
| 2015 | ISCAS | Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials. | Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury |