| 2018 | WSC | Bridging the Gap between fab simulation and supply Chain Forecast. | Wolfgang Scholl, Matthias Forster, Patrick Preuss, Andr Naumann, Hui Ping Ooi, Boon-Ping Gan |
| 2018 | WSC | Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation. | Georg Seidel, Patrick Preuss, Andr Naumann, Soo Leen Low, Chew Wye Chan, Boon-Ping Gan |
| 2017 | WSC | Harmonizing operations management of key stakeholders in wafer fab using discrete event simulation. | Georg Seidel, Ching Foong Lee, Ai Mei Kam, Boon-Ping Gan, Chew Wye Chan, Andr Naumann, Patrick Preuss |
| 2016 | WSC | Simulation-enabled development lot journey smoothening in a fully-utilised semiconductor manufacturing line. | Wolfgang Scholl, Matthias Forster, Patrick Preuss, Andr Naumann, Boon-Ping Gan, Peter Lendermann |
| 2014 | WSC | Enhancement of simulation-based semiconductor manufacturing forecast quality through hybrid tool down time modeling. | Patrick Preuss, Andr Naumann, Wolfgang Scholl, Boon-Ping Gan, Peter Lendermann |