Barry J. Rubin
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2009–2009
Best venue rank
A
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2009 | ICCAD | Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. | Chuan Xu, Lijun Jiang, Seshadri K. Kolluri, Barry J. Rubin, Alina Deutsch, Howard H. Smith, Kaustav Banerjee |