Ben Greenspan
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
3
Venues
2
Active years
2020–2023
Best venue rank
A*
Where they publish
Papers
3 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2023 | CHI | MechSense: A Design and Fabrication Pipeline for Integrating Rotary Encoders into 3D Printed Mechanisms. | Marwa Alalawi, Noah Pacik-Nelson, Junyi Zhu, Ben Greenspan, Andrew Doan, Brandon M. Wong, Benjamin Owen-Block, Shanti Kaylene Mickens, Wilhelm Jacobus Schoeman, Michael Wessely, Andreea Danielescu, Stefanie Mueller |
| 2021 | CHI | Self-deStaining Textiles: Designing Interactive Systems with Fabric, Stains and Light. | Fiona Bell, Alice Hong, Andreea Danielescu, Aditi Maheshwari, Ben Greenspan, Hiroshi Ishii, Laura Devendorf, Mirela Alistar |
| 2020 | UIST | Designing Low-Cost Sports Prosthetics with Advanced 3D Printing Techniques. | Ben Greenspan, Andreea Danielescu |