Bing-Jhang Lin
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
2
Active years
2018–2018
Best venue rank
B
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2018 | ICONIP | Use 3D Convolutional Neural Network to Inspect Solder Ball Defects. | Bing-Jhang Lin, Ting-Chen Tsan, Tzu-Chia Tung, You-Hsien Lee, Chiou-Shann Fuh |
| 2018 | Tencon | Solder Ball 3D Reconstruction with X-Ray Images Using Filtered Back Projection. | Ting-Chen Tsan, Bing-Jhang Lin, You-Hsien Lee, Tzu-Chia Tung, Chiou-Shann Fuh |