Bo-Wen Chen
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2026–2026
Best venue rank
B
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2026 | ASPDAC | ThPA: Thermal Simulation for Advanced ICs. | Bo-Wen Chen, Yong-Han Lin, Chien-Yu Lin, Yu-Min Lee |