Cesely Smith
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2026–2026
Best venue rank
A
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2026 | DATE | 3D IC Thermal Management with BEOL Wafer-Scale Sputtered Vertical h-BN. | Cesely Smith, B. Reese, A. Raut, Y.-T. Yang, J.-G. Zhu, Tathagata Srimani |