Chae Young Sim
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2025–2025
Best venue rank
A
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | ISLPED | Thermal Challenges and Opportunities for Off-the-shelf 3D-stacked CPUs. | Jae Yoon Lee, Chae Young Sim, Seung Hun Choi, Sung Woo Chung |