| 2025 | WSC | Sensitivity Analysis of the SMT2020 Testbed for Risk-Based Maintenance in Semiconductor Manufacturing. | Philipp Andelfinger, Shuaibing Lu, Chew Wye Chan, Feifei Zhang, Boon Ping Gan, Jie Zhang, Wentong Cai |
| 2024 | WSC | A Standard Framework for AI-Driven Optimizations in Various Complex Domains. | Tobias Bosse, Evangelos Angelidis, Feifei Zhang, Chew Wye Chan, Boon Ping Gan, Matthias Werner, Andrej Gisbrecht |
| 2024 | WSC | Enhancing Machine Learning for Situation Aware Dispatching Through Generative Adversarial Network Based Synthetic Data Generation. | Chew Wye Chan, Boon Ping Gan, Wentong Cai |
| 2023 | WSC | Combining Time Series Data and Snapshot Data for Situation Aware Dispatching in Semiconductor Manufacturing. | Chew Wye Chan, Boon Ping Gan, Wentong Cai |
| 2023 | WSC | Dispatching in Real Frontend Fabs With Industrial Grade Discrete-Event Simulations by Deep Reinforcement Learning with Evolution Strategies. | Patrick Stckermann, Alessandro Immordino, Thomas Altenmller, Georg Seidel, Martin Gebser, Pierre Tassel, Chew Wye Chan, Feifei Zhang |
| 2022 | WSC | Graph Representation and Embedding for Semiconductor Manufacturing Fab States. | Benedikt Schulz, Christoph Jacobi, Andrej Gisbrecht, Evangelos Angelidis, Chew Wye Chan, Boon Ping Gan |
| 2020 | PADS | Runtime Abstraction-Level Conversion of Discrete-Event Wafer-fabrication Models for Simulation Acceleration. | Moon Gi Seok, Chew Wye Chan, Wentong Cai, Hessam S. Sarjoughian, Daejin Park |
| 2020 | WSC | Towards Situation Aware Dispatching in a Dynamic and Complex Manufacturing Environment. | Chew Wye Chan, Boon Ping Gan, Wentong Cai |
| 2019 | WSC | An Integration of Static and Dynamic Capacity Planning for a Ramping Fab. | Georg Seidel, Patrick Preuss, Cevahir Canbolat, Soo Leen Low, Chew Wye Chan, Boon Ping Gan, Ching Foong Lee, Prakash Manogaran, Aik Ying Tang |
| 2018 | WSC | Operator Resource modelling in a Multiple wafer Sizes fabrication Environment using discrete Event simulation. | Georg Seidel, Patrick Preuss, Andr Naumann, Soo Leen Low, Chew Wye Chan, Boon-Ping Gan |
| 2017 | WSC | Harmonizing operations management of key stakeholders in wafer fab using discrete event simulation. | Georg Seidel, Ching Foong Lee, Ai Mei Kam, Boon-Ping Gan, Chew Wye Chan, Andr Naumann, Patrick Preuss |