Ching-Kun Yang
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2004–2004
Best venue rank
B
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2004 | SMC | Reconstructing the 3D solder paste surface model using image processing and artificial neural network. | Fang-Chung Yang, Chung-Hsien Kuo, Jein-Jong Wing, Ching-Kun Yang |