Chung-Chia Lee
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2023–2023
Best venue rank
A
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2023 | ICCAD | Floorplanning for Embedded Multi-Die Interconnect Bridge Packages. | Chung-Chia Lee, Yao-Wen Chang |