Daniel P. Seemuth
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2017–2017
Best venue rank
B
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2017 | ASPDAC | Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers. | Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow |