| 2026 | HPCA | Characterizing Cloud-Native LLM Inference at Bytedance and Exposing Optimization Challenges and Opportunities for Future AI Accelerators. | Jingwei Cai, Dehao Kong, Hantao Huang, Zishan Jiang, Zixuan Ma, Qingyu Guo, Zhenxing Zhang, Guiming Shi, Mingyu Gao, Kaisheng Ma, Minghui Yu |
| 2026 | HPCA | FACE: Fully Overlapped PD Scheduling and Multi-Level Architecture Co-Exploration on Wafer. | Zheng Xu, Dehao Kong, Jiaxin Liu, Dingcheng Jiang, Xu Dai, Jinyi Deng, Yang Hu, Shouyi Yin |
| 2025 | ICCD | RAM-Wafer: RL-Based Automatic Mapping Framework for Large-Scale AI Training on Wafer-Scale Computing. | Xu Dai, Dehao Kong, Xufeng He, Zijun Xu, Shaopeng Zhai, Yang Hu, Shouyi Yin |
| 2025 | ISCA | WSC-LLM: Efficient LLM Service and Architecture Co-exploration for Wafer-scale Chips. | Zheng Xu, Dehao Kong, Jiaxin Liu, Jinxi Li, Jingxiang Hou, Xu Dai, Chao Li, Shaojun Wei, Yang Hu, Shouyi Yin |
| 2019 | IECON | Operating Modes Analysis and Control Strategy of Single-Stage Isolated Modular Multilevel Converter (I-MMC) for Medium Voltage AC/DC Grid. | Dehao Kong, Chuang Liu, Hong Ying, Zhongchen Pei, Jinming Li, Haoran Zhang |