| 2020 | ICCAD | Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design. | M. D. Arafat Kabir, Dusan Petranovic, Yarui Peng |
| 2015 | ICCAD | Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs. | Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim |
| 2014 | DAC | Fast and Accurate Full-chip Extraction and Optimization of TSV-to-Wire Coupling. | Yarui Peng, Dusan Petranovic, Sung Kyu Lim |
| 2013 | ICCAD | On accurate full-chip extraction and optimization of TSV-to-TSV coupling elements in 3D ICs. | Yarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim |
| 2007 | ASPDAC | Simple and Accurate Models for Capacitance Increment due to Metal Fill Insertion. | Youngmin Kim, Dusan Petranovic, Dennis Sylvester |
| 2007 | ICCAD | Including inductance in static timing analysis. | Ahmed Shebaita, Dusan Petranovic, Yehea I. Ismail |
| 2006 | ICCAD | Importance of volume discretization of single and coupled interconnects. | Ahmed Shebaita, Dusan Petranovic, Yehea I. Ismail |
| 2001 | DAC | MetaCores: Design and Optimization Techniques. | Seapahn Meguerdichian, Farinaz Koushanfar, Advait M. Mogre, Dusan Petranovic, Miodrag Potkonjak |