Faaiq Waqar
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2026–2026
Best venue rank
A*
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2026 | ISCA | Omelet: A Packaging-Aware Hierarchical Interconnect Simulator for 2.5D/3D Chiplet Architectures. | Jiho Kim, Danish Baig, Faaiq Waqar, Ashita Victor, Shimeng Yu, Muhannad S. Bakir, Cong Hao |