| 2025 | ASPDAC | Dual-branch cross-modal fusion with local-to-global learning for UAV object detection. | Binyi Fang, Yixin Yang, Jingjing Chang, Ziyang Gao, Hai-Bao Chen |
| 2025 | DAC | DuQTTA: Dual Quantized Tensor-Train Adaptation with Decoupling Magnitude-Direction for Efficient Fine-Tuning of LLMs. | Haoyan Dong, Hai-Bao Chen, Jingjing Chang, Yixin Yang, Ziyang Gao, Zhigang Ji, Runsheng Wang, Ru Huang |
| 2025 | ICCAD | Equivalent Lumped Element Model for Electromigration Considering Thermal Effects. | Hengyi Zhu, Wenjie Zhu, Tianshu Hou, Zhigang Ji, Runsheng Wang, Min Tang, Hai-Bao Chen |
| 2024 | ASPDAC | Physics-Informed Learning for EPG-Based TDDB Assessment. | Dinghao Chen, Wenjie Zhu, Xiaoman Yang, Pengpeng Ren, Zhigang Ji, Hai-Bao Chen |
| 2024 | ASPDAC | Physics-Informed Learning for Versatile RRAM Reset and Retention Simulation. | Tianshu Hou, Yuan Ren, Wenyong Zhou, Can Li, Zhongrui Wang, Hai-Bao Chen, Ngai Wong |
| 2024 | ICCAD | Enforcing hard constraints in physics-informed learning for transient TSV electromigration analysis. | Xiaoman Yang, Hai-Bao Chen, Wenjie Zhu, Yuhan Zhang, Yongkang Xue, Pengpeng Ren, Runsheng Wang, Zhigang Ji, Ru Huang |
| 2022 | AAAI | Deeply Tensor Compressed Transformers for End-to-End Object Detection. | Peining Zhen, Ziyang Gao, Tianshu Hou, Yuan Cheng, Hai-Bao Chen |
| 2022 | COMPSAC | Automatic Monitoring System for Engines Motion Attitude Based on Video Image Detection. | Yiwei Fang, Guan Wang, Ruilin Zeng, Xiaoyu Wang, Hai-Bao Chen |
| 2022 | WACV | FASSST: Fast Attention Based Single-Stage Segmentation Net for Real-Time Instance Segmentation. | Yuan Cheng, Rui Lin, Peining Zhen, Tianshu Hou, Chiu Wa Ng, Hai-Bao Chen, Hao Yu, Ngai Wong |
| 2021 | WACV | S3-Net: A Fast and Lightweight Video Scene Understanding Network by Single-shot Segmentation. | Yuan Cheng, Yuchao Yang, Hai-Bao Chen, Ngai Wong, Hao Yu |
| 2020 | DATE | An Anomaly Comprehension Neural Network for Surveillance Videos on Terminal Devices. | Yuan Cheng, Guangtai Huang, Peining Zhen, Bin Liu, Hai-Bao Chen, Ngai Wong, Hao Yu |
| 2019 | ICCAD | DEEPEYE: A Deeply Tensor-Compressed Neural Network Hardware Accelerator: Invited Paper. | Yuan Cheng, Guangya Li, Ngai Wong, Hai-Bao Chen, Hao Yu |
| 2016 | ASPDAC | Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. | Xin Huang, Valeriy Sukharev, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan |
| 2016 | ASPDAC | Thermal modeling for energy-efficient smart building with advanced overfitting mitigation technique. | Wandi Liu, Hai Wang, Hengyang Zhao, Shujuan Wang, Hai-Bao Chen, Yuzhuo Fu, Jian Ma, Xin Li, Sheldon X.-D. Tan |
| 2016 | DATE | Learning-based dynamic reliability management for dark silicon processor considering EM effects. | Taeyoung Kim, Xin Huang, Hai-Bao Chen, Valeriy Sukharev, Sheldon X.-D. Tan |
| 2016 | ICCAD | Dynamic reliability management for near-threshold dark silicon processors. | Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan |
| 2016 | ISCAS | Learning-based occupancy behavior detection for smart buildings. | Hengyang Zhao, Zhongdong Qi, Shujuan Wang, Kambiz Vafai, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan |
| 2015 | ASPDAC | New electromigration modeling and analysis considering time-varying temperature and current densities. | Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Valeriy Sukharev |
| 2015 | DAC | Interconnect reliability modeling and analysis for multi-branch interconnect trees. | Hai-Bao Chen, Sheldon X.-D. Tan, Valeriy Sukharev, Xin Huang, Taeyoung Kim |
| 2015 | ICCAD | Learning Based Compact Thermal Modeling for Energy-Efficient Smart Building Management: (invited). | Hengyang Zhao, Daniel Quach, Shujuan Wang, Hai Wang, Hai-Bao Chen, Xin Li, Sheldon X.-D. Tan |
| 2014 | ICCAD | Lifetime optimization for real-time embedded systems considering electromigration effects. | Taeyoung Kim, Bowen Zheng, Hai-Bao Chen, Qi Zhu, Valeriy Sukharev, Sheldon X.-D. Tan |
| 2014 | ICCAD | IR-drop based electromigration assessment: parametric failure chip-scale analysis. | Valeriy Sukharev, Xin Huang, Hai-Bao Chen, Sheldon X.-D. Tan |