Howard H. Smith
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
2
Active years
2004–2009
Best venue rank
A
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2009 | ICCAD | Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. | Chuan Xu, Lijun Jiang, Seshadri K. Kolluri, Barry J. Rubin, Alina Deutsch, Howard H. Smith, Kaustav Banerjee |
| 2004 | DATE | A CAD Methodology and Tool for the Characterization of Wide On-Chip Buses. | Ibrahim M. Elfadel, Alina Deutsch, Gerard V. Kopcsay, Bradley Rubin, Howard H. Smith |