Hsuan-Hsuan Hsiao
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
2
Active years
2017–2019
Best venue rank
B
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2019 | ASPDAC | Multi-angle bended heat pipe design using x-architecture routing with dynamic thermal weight on mobile devices. | Hsuan-Hsuan Hsiao, Hong-Wen Chiou, Yu-Min Lee |
| 2017 | ICCAD | Thermal modeling and design on smartphones with heat pipe cooling technique. | Hong-Wen Chiou, Yu-Min Lee, Hsuan-Hsuan Hsiao, Liang-Chia Cheng |