Hsueh-Ju Lin
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
2
Active years
2014–2014
Best venue rank
A*
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2014 | DAC | Contactless Stacked-die Testing for Pre-bond Interposers. | Jui-Hung Chien, Ruei-Siang Hsu, Hsueh-Ju Lin, Ka-Yi Yeh, Shih-Chieh Chang |
| 2014 | DATE | Package geometric aware thermal analysis by infrared-radiation thermal images. | Jui-Hung Chien, Hao Yu, Ruei-Siang Hsu, Hsueh-Ju Lin, Shih-Chieh Chang |