Hyunsu Chae
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
6
Venues
4
Active years
2018–2025
Best venue rank
A*
Where they publish
Papers
6 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | ASPDAC | ML-Assisted RF IC Design Enablement: the New Frontier of AI for EDA. | Hyunsu Chae, Song Hang Chai, Taiyun Chi, Sensen Li, David Z. Pan |
| 2025 | ICCAD | Invited Paper: Towards Generative AI for Analog and RF IC Design: From Spec to Layout. | Hyunsu Chae, Seunggeun Kim, Souradip Poddar, Xiaohan Gao, Sensen Li, David Z. Pan |
| 2024 | ASPDAC | ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning. | Hyunsu Chae, Keren Zhu, Bhyrav Mutnury, Zixuan Jiang, Daniel De Araujo, Douglas Wallace, Douglas Winterberg, Adam R. Klivans, David Z. Pan |
| 2024 | ICCAD | PulseRF: Physics Augmented ML Modeling and Synthesis for High-Frequency RFIC Design. | Hyunsu Chae, Hao Yu, Sensen Li, David Z. Pan |
| 2023 | DATE | ISOP: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design. | Hyunsu Chae, Bhyrav Mutnury, Keren Zhu, Douglas Wallace, Douglas Winterberg, Daniel De Araujo, Jay Reddy, Adam R. Klivans, David Z. Pan |
| 2018 | DAC | Test cost reduction for | Hyunsu Chae, Joon-Sung Yang |