Je-Wei Chuang
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
1
Active years
2023–2024
Best venue rank
A*
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2024 | DAC | Redistribution Layer Routing with Dynamic Via Insertion Under Irregular Via Structures. | Je-Wei Chuang, Zong-Han Wu, Bo-Ying Huang, Yao-Wen Chang |
| 2023 | DAC | Any-Angle Routing for Redistribution Layers in 2.5D IC Packages. | Min-Hsuan Chung, Je-Wei Chuang, Yao-Wen Chang |