Kangbo Bai
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
3
Venues
3
Active years
2025–2026
Best venue rank
A*
Where they publish
Papers
3 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2026 | ASPDAC | Chat-A | Zhantong Zhu, Kangbo Bai, Tianyu Jia |
| 2026 | DATE | ChipLight: Cross-Layer Optimization of Chiplet Design with Optical Interconnects for LLM Training. | Kangbo Bai, Zhantong Zhu, Yifan Ding, Tianyu Jia |
| 2025 | DAC | EdgeMM: Multi-Core CPU with Heterogeneous AI-Extension and Activation-aware Weight Pruning for Multimodal LLMs at Edge. | Kangbo Bai, Le Ye, Ru Huang, Tianyu Jia |