Kapil Dev
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
2
Active years
2013–2013
Best venue rank
A*
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2013 | DAC | High-throughput TSV testing and characterization for 3D integration using thermal mapping. | Kapil Dev, Gary L. Woods, Sherief Reda |
| 2013 | ISLPED | Power mapping and modeling of multi-core processors. | Kapil Dev, Abdullah Nazma Nowroz, Sherief Reda |