Skip to content

Kefang Qian

Publication record assembled from the DBLP archive of ranked conferences.

Papers indexed

1

Venues

1

Active years

2018–2018

Best venue rank

C

Where they publish

Papers

1 indexed papers, newest first.

YearVenueTitleAuthors
2018ISCASStudy of silicon core coaxial through silicon via for three dimensional integration.Libo Qian, Xitao He, Kefang Qian, Yinshui Xia