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Kevin Lepak

Publication record assembled from the DBLP archive of ranked conferences.

Papers indexed

2

Venues

2

Active years

2021–2021

Best venue rank

A*

Where they publish

Papers

2 indexed papers, newest first.

YearVenueTitleAuthors
2021DATEUnderstanding Chiplets Today to Anticipate Future Integration Opportunities and Limits.Gabriel H. Loh, Samuel Naffziger, Kevin Lepak
2021ISCAPioneering Chiplet Technology and Design for the AMD EPYC™ and Ryzen™ Processor Families : Industrial Product.Samuel Naffziger, Noah Beck, Thomas Burd, Kevin Lepak, Gabriel H. Loh, Mahesh Subramony, Sean White