KilBum Kang
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
2
Active years
2017–2018
Best venue rank
C
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2018 | ICPRAM | The Method to Measure Si Thickness for Bond Line Thickness. | YangSub Park, KilBum Kang, Sang-Yun Yun, SeongSoo Kim |
| 2017 | CAIP | A Visual Inspection Method Based on Periodic Feature for Wheel Mark Defect on Wafer Backside. | YangSub Park, KilBum Kang, SeongSoo Kim |