Klaus Piech
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
1
Active years
2014–2015
Best venue rank
C
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2015 | IECON | Low-cost integration of hardware components into co-simulation for future power and energy systems. | Okko Nannen, Klaus Piech, Sebastian Lehnhoff, Sebastian Rohjans, Florian Schlgl, Jorge Velasquez, Filip Andren, Thomas I. Strasser |
| 2014 | IECON | Towards a process for integrated IEC 61850 and OPC UA communication: Using the example of smart grid protection equipment. | Martin Bscher, Matthias Kube, Sebastian Lehnhoff, Klaus Piech, Sebastian Rohjans, Jrn Trefke |