Lee Coulbeck
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
1
Active years
2013–2021
Best venue rank
C
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2021 | IECON | Substrate Solder Crack Evaluation and Modelling of Power Module under Passive Cycling. | Zhongxu Wang, Yangang Wang, Lee Coulbeck, Xiang Li, Wei Gong |
| 2013 | IECON | Optimization of p-emitter/n-buffer using laser annealing technique in IGBT design. | Chunlin Zhu, Ian Deviny, Ben Yu, Lee Coulbeck, Gary Liu, Jim Thomson |