Lingjun Zhu
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
21
Venues
10
Active years
2020–2026
Best venue rank
A*
Where they publish
Papers
21 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2026 | EuroSys | SmartNS: Enabling Line-rate and Flexible Network Stack with SmartNIC. | Xuzheng Chen, Jie Zhang, Baolin Zhu, Xueying Zhu, Zhongqing Chen, Ting Fu, Shu Ma, Lingjun Zhu, Chao Shi, Yin Zhang, Yuanchao Shu, Peng Cheng, Zeke Wang |
| 2026 | NSDI | Come Hell or Still Water: Alleviating Tail Latency in Cloud Block Store. | Chaolei Hu, Kun Qian, Erci Xu, Yifan Shen, Haoran Zhang, Xue Li, Yuesheng Gu, Lingjun Zhu, Fengyuan Ren, Ennan Zhai |
| 2025 | EuroSys | Hey Hey, My My, Skewness Is Here to Stay: Challenges and Opportunities in Cloud Block Store Traffic. | Haonan Wu, Erci Xu, Ligang Wang, Yuandong Hong, Changsheng Niu, Bo Shi, Lingjun Zhu, Jinnian He, Dong Wu, Weidong Zhang, Qiuping Wang, Changhong Wang, Xinqi Chen, Guangtao Xue, Yi-Chao Chen, Dian Ding |
| 2025 | SIGCOMM | Alibaba Stellar: A New Generation RDMA Network for Cloud AI. | Jie Lu, Jiaqi Gao, Fei Feng, Zhiqiang He, Menglei Zheng, Kun Liu, Jun He, Binbin Liao, Suwei Xu, Ke Sun, Yongjia Mo, Qinghua Peng, Jilie Luo, Qingxu Li, Gang Lu, Zishu Wang, Jianbo Dong, Kunling He, Sheng Cheng, Jiamin Cao, Hairong Jiao, Pengcheng Zhang, Shu Ma, Lingjun Zhu, Chao Shi, Yangming Zhang, Yiquan Chen, Wei Wang, Shuhong Zhu, Xingru Li, Qiang Wang, Jiang Liu, Chao Wang, Wei Lin, Ennan Zhai, Jiesheng Wu, Qiang Liu, Binzhang Fu, Dennis Cai |
| 2024 | DAC | GNN-assisted Back-side Clock Routing Methodology for Advance Technologies. | Nesara Eranna Bethur, Pruek Vanna-Iampikul, Odysseas Zografos, Lingjun Zhu, Giuliano Sisto, Dragomir Milojevic, Alberto Garca Ortiz, Geert Hellings, Julien Ryckaert, Francky Catthoor, Sung Kyu Lim |
| 2024 | FAST | What's the Story in EBS Glory: Evolutions and Lessons in Building Cloud Block Store. | Weidong Zhang, Erci Xu, Qiuping Wang, Xiaolu Zhang, Yuesheng Gu, Zhenwei Lu, Tao Ouyang, Guanqun Dai, Wenwen Peng, Zhe Xu, Shuo Zhang, Dong Wu, Yilei Peng, Tianyun Wang, Haoran Zhang, Jiasheng Wang, Wenyuan Yan, Yuanyuan Dong, Wenhui Yao, Zhongjie Wu, Lingjun Zhu, Chao Shi, Yinhu Wang, Rong Liu, Junping Wu, Jiaji Zhu, Jiesheng Wu |
| 2024 | ICNP | Demystifying Datapath Accelerator Enhanced Off-path SmartNIC. | Xuzheng Chen, Jie Zhang, Ting Fu, Yifan Shen, Shu Ma, Kun Qian, Lingjun Zhu, Chao Shi, Yin Zhang, Ming Liu, Zeke Wang |
| 2024 | ISLPED | Hetero-3D: Maximizing Performance and Power Delivery Benefits of Heterogeneous 3D ICs. | Lingjun Zhu, Jiawei Hu, Gauthaman Murali, Sung Kyu Lim |
| 2023 | DAC | Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits. | Pruek Vanna-Iampikul, Lingjun Zhu, Serhat Erdogan, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Sung Kyu Lim |
| 2023 | DAC | INVITED: Design Automation Needs for Monolithic 3D ICs: Accomplishments and Gaps. | Lingjun Zhu, Sung Kyu Lim |
| 2023 | ISCA | SmartDS: Middle-Tier-centric SmartNIC Enabling Application-aware Message Split for Disaggregated Block Storage. | Jie Zhang, Hongjing Huang, Lingjun Zhu, Shu Ma, Dazhong Rong, Yijun Hou, Mo Sun, Chaojie Gu, Peng Cheng, Chao Shi, Zeke Wang |
| 2023 | ISLPED | A Comparative Study on Front-Side, Buried and Back-Side Power Rail Topologies in 3nm Technology Node. | Sandra Maria Shaji, Lingjun Zhu, Jun-Sik Yoon, Sung Kyu Lim |
| 2023 | USENIX | Deploying User-space TCP at Cloud Scale with LUNA. | Lingjun Zhu, Yifan Shen, Erci Xu, Bo Shi, Ting Fu, Shu Ma, Shuguang Chen, Zhongyu Wang, Haonan Wu, Xingyu Liao, Zhendan Yang, Zhongqing Chen, Wei Lin, Yijun Hou, Rong Liu, Chao Shi, Jiaji Zhu, Jiesheng Wu |
| 2022 | ISLPED | 3D IC Tier Partitioning of Memory Macros: PPA vs. Thermal Tradeoffs. | Lingjun Zhu, Nesara Eranna Bethur, Yi-Chen Lu, Youngsang Cho, Yunhyeok Im, Sung Kyu Lim |
| 2022 | NSDI | Buffer-based End-to-end Request Event Monitoring in the Cloud. | Kaihui Gao, Chen Sun, Shuai Wang, Dan Li, Yu Zhou, Hongqiang Harry Liu, Lingjun Zhu, Ming Zhang |
| 2022 | SIGCOMM | From luna to solar: the evolutions of the compute-to-storage networks in Alibaba cloud. | Rui Miao, Lingjun Zhu, Shu Ma, Kun Qian, Shujun Zhuang, Bo Li, Shuguang Cheng, Jiaqi Gao, Yan Zhuang, Pengcheng Zhang, Rong Liu, Chao Shi, Binzhang Fu, Jiaji Zhu, Jiesheng Wu, Dennis Cai, Hongqiang Harry Liu |
| 2021 | DAC | Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options. | Jinwoo Kim, Lingjun Zhu, Hakki Mert Torun, Madhavan Swaminathan, Sung Kyu Lim |
| 2021 | ISLPED | Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture. | Lingjun Zhu, Tuan Ta, Rossana Liu, Rahul Mathur, Xiaoqing Xu, Shidhartha Das, Ankit Kaul, Alejandro Rico, Doug Joseph, Brian Cline, Sung Kyu Lim |
| 2020 | DAC | TP-GNN: A Graph Neural Network Framework for Tier Partitioning in Monolithic 3D ICs. | Yi-Chen Lu, Sai Surya Kiran Pentapati, Lingjun Zhu, Kambiz Samadi, Sung Kyu Lim |
| 2020 | DATE | Macro-3D: A Physical Design Methodology for Face-to-Face-Stacked Heterogeneous 3D ICs. | Lennart Bamberg, Alberto Garca Ortiz, Lingjun Zhu, Sai Pentapati, Da Eun Shim, Sung Kyu Lim |
| 2020 | SIGCOMM | Flow Event Telemetry on Programmable Data Plane. | Yu Zhou, Chen Sun, Hongqiang Harry Liu, Rui Miao, Shi Bai, Bo Li, Zhilong Zheng, Lingjun Zhu, Zhen Shen, Yongqing Xi, Pengcheng Zhang, Dennis Cai, Ming Zhang, Mingwei Xu |