Michael Scheuermann
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
5
Venues
4
Active years
2011–2021
Best venue rank
A*
Where they publish
Papers
5 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2021 | ISCA | RaPiD: AI Accelerator for Ultra-low Precision Training and Inference. | Swagath Venkataramani, Vijayalakshmi Srinivasan, Wei Wang, Sanchari Sen, Jintao Zhang, Ankur Agrawal, Monodeep Kar, Shubham Jain, Alberto Mannari, Hoang Tran, Yulong Li, Eri Ogawa, Kazuaki Ishizaki, Hiroshi Inoue, Marcel Schaal, Mauricio J. Serrano, Jungwook Choi, Xiao Sun, Naigang Wang, Chia-Yu Chen, Allison Allain, James Bonanno, Nianzheng Cao, Robert Casatuta, Matthew Cohen, Bruce M. Fleischer, Michael Guillorn, Howard Haynie, Jinwook Jung, Mingu Kang, Kyu-Hyoun Kim, Siyu Koswatta, Sae Kyu Lee, Martin Lutz, Silvia M. Mueller, Jinwook Oh, Ashish Ranjan, Zhibin Ren, Scot Rider, Kerstin Schelm, Michael Scheuermann, Joel Silberman, Jie Yang, Vidhi Zalani, Xin Zhang, Ching Zhou, Matthew M. Ziegler, Vinay Shah, Moriyoshi Ohara, Pong-Fei Lu, Brian W. Curran, Sunil Shukla, Leland Chang, Kailash Gopalakrishnan |
| 2018 | ISLPED | Across the Stack Opportunities for Deep Learning Acceleration. | Vijayalakshmi Srinivasan, Bruce M. Fleischer, Sunil Shukla, Matthew M. Ziegler, Joel Silberman, Jinwook Oh, Jungwook Choi, Silvia M. Mueller, Ankur Agrawal, Tina Babinsky, Nianzheng Cao, Chia-Yu Chen, Pierce Chuang, Thomas W. Fox, George Gristede, Michael Guillorn, Howard Haynie, Michael J. Klaiber, Dongsoo Lee, Shih-Hsien Lo, Gary W. Maier, Michael Scheuermann, Swagath Venkataramani, Christos Vezyrtzis, Naigang Wang, Fanchieh Yee, Ching Zhou, Pong-Fei Lu, Brian W. Curran, Leland Chang, Kailash Gopalakrishnan |
| 2013 | ICCAD | Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. | Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim |
| 2012 | DAC | Analysis of DC current crowding in through-silicon-vias and its impact on power integrity in 3D ICs. | Xin Zhao, Michael Scheuermann, Sung Kyu Lim |
| 2011 | DAC | Design, CAD and technology challenges for future processors: 3D perspectives. | Jeff Burns, Gary Carpenter, Eren Kursun, Ruchir Puri, James D. Warnock, Michael Scheuermann |