Min-Hsuan Chung
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
2
Venues
2
Active years
2022–2023
Best venue rank
A*
Where they publish
Papers
2 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2023 | DAC | Any-Angle Routing for Redistribution Layers in 2.5D IC Packages. | Min-Hsuan Chung, Je-Wei Chuang, Yao-Wen Chang |
| 2022 | ICCAD | Transitive Closure Graph-Based Warpage-Aware Floorplanning for Package Designs. | Yang Hsu, Min-Hsuan Chung, Yao-Wen Chang, Ci-Hong Lin |