| 2014 | DAC | On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. | Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim |
| 2013 | ASPDAC | Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffs. | Krit Athikulwongse, Dae Hyun Kim, Moongon Jung, Sung Kyu Lim |
| 2013 | ICCAD | Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives. | Chun Zhang, Moongon Jung, Sung Kyu Lim, Yiyu Shi |
| 2012 | ASPDAC | Design for manufacturability and reliability for TSV-based 3D ICs. | David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Moongon Jung, Joydeep Mitra, Jiwoo Pak, Mohit Pathak, Jae-Seok Yang |
| 2012 | DAC | Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs. | Moongon Jung, David Z. Pan, Sung Kyu Lim |
| 2011 | DAC | TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC. | Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim |
| 2011 | ICCAD | Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC. | Moongon Jung, Xi Liu, Suresh K. Sitaraman, David Z. Pan, Sung Kyu Lim |