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Muhannad S. Bakir

Publication record assembled from the DBLP archive of ranked conferences.

Papers indexed

2

Venues

2

Active years

2009–2026

Best venue rank

A*

Where they publish

Papers

2 indexed papers, newest first.

YearVenueTitleAuthors
2026ISCAOmelet: A Packaging-Aware Hierarchical Interconnect Simulator for 2.5D/3D Chiplet Architectures.Jiho Kim, Danish Baig, Faaiq Waqar, Ashita Victor, Shimeng Yu, Muhannad S. Bakir, Cong Hao
2009DATECo-design of signal, power, and thermal distribution networks for 3D ICs.Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad S. Bakir, Yogendra K. Joshi, Andrei G. Fedorov, Sung Kyu Lim