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Myeongseong Kim

Publication record assembled from the DBLP archive of ranked conferences.

Papers indexed

5

Venues

4

Active years

2020–2026

Best venue rank

A*

Where they publish

Papers

5 indexed papers, newest first.

YearVenueTitleAuthors
2026CHITF-Shell: Facilitating Physical Deformation with Iterative and Shape Memory Thermoforming for 3D Printing.Donghyeon Ko, Myeongseong Kim, Yoonji Kim, Woohun Lee
2023SIGGRAPHTime to Snow.Myeongseong Kim, Sunwoo Baek, Woohun Lee
2022UISTThermoformable Shell for Repeatable Thermoforming.Donghyeon Ko, Myeongseong Kim, Woohun Lee
2021SIGGRAPHIsle of reflections.Chaeeun Lee, Myeongseong Kim, Hyunjung Kim
2020TEIRolling Pixels: Robotic Steinmetz Solids for Creating Physical Animations.Yujin Lee, Myeongseong Kim, Hyunjung Kim