| 2026 | DATE | Efficient Warpage Simulation of Complex 2.5-D/3-D IC Structures with Novel Meshing Algorithm and Layerwise Plate Theory. | Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang |
| 2025 | DAC | SDM-PEB: Spatial-Depthwise Mamba for Enhanced Post-Exposure Bake Simulation. | Ziyang Yu, Peng Xu, Zixiao Wang, Binwu Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Bei Yu, Martin D. F. Wong |
| 2025 | DATE | MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC. | Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Ru Huang |
| 2025 | ICCAD | High-Resolution Full-Chip Thermal Resistance Extraction of BEOL Interconnects in 3-D ICs Considering Detailed Via Connectivity. | Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang |
| 2024 | ICCAD | ATPlace2.5D: Analytical Thermal-Aware Chiplet Placement Framework for Large-Scale 2.5D-IC. | Qipan Wang, Xueqing Li, Tianyu Jia, Yibo Lin, Runsheng Wang, Ru Huang |
| 2024 | ICCAD | FaStTherm: Fast and Stable Full-Chip Transient Thermal Predictor Considering Nonlinear Effects. | Tianxiang Zhu, Qipan Wang, Yibo Lin, Runsheng Wang, Ru Huang |
| 2023 | DAC | MTL-Designer: An Integrated Flow for Analysis and Synthesis of Microstrip Transmission Line. | Qipan Wang, Ping Liu, Liguo Jiang, Mingjie Liu, Yibo Lin, Runsheng Wang, Ru Huang |
| 2022 | ICCAD | DeePEB: A Neural Partial Differential Equation Solver for Post Exposure Baking Simulation in Lithography. | Qipan Wang, Xiaohan Gao, Yibo Lin, Runsheng Wang, Ru Huang |