Seungmi Oh
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2025–2025
Best venue rank
B
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | ICIP | Robust Estimation of Bump Height for Wafer-Level Packaging Using Optical Triangulation. | Seungmi Oh, Yujin Jang, Jeongtae Kim |