Shengcheng Wang
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
6
Venues
3
Active years
2014–2017
Best venue rank
A
Where they publish
Papers
6 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2017 | DATE | Recovery-aware proactive TSV repair for electromigration in 3D ICs. | Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori |
| 2017 | ICCAD | Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. | Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori |
| 2016 | DATE | Thermal-aware TSV repair for electromigration in 3D ICs. | Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty |
| 2015 | ASPDAC | Stress-aware P/G TSV planning in 3D-ICs. | Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori |
| 2015 | ICCAD | Defect Clustering-Aware Spare-TSV Allocation for 3D ICs. | Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty |
| 2014 | DATE | P/G TSV planning for IR-drop reduction in 3D-ICs. | Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori |