Shunxiang Lan
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
4
Venues
3
Active years
2024–2026
Best venue rank
A*
Where they publish
Papers
4 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2026 | ASPDAC | Domain Transformation and Decomposition Method for Composable Thermal Modeling and Simulation of Chiplet-Based 2.5D Integrated System. | Shunxiang Lan, Min Tang |
| 2026 | ASPDAC | Efficient Simulation of IC Packages with TEC Based on Adaptive Segmented Method and Spatially-Aware Thermal Neural Network. | Longfei Li, Xinyue Li, Shunxiang Lan, Liang Chen, Haibao Chen, Min Tang |
| 2025 | DATE | Flexible Thermal Conductance Model (TCM) for Efficient Thermal Simulation of 3-D ICs and Packages. | Shunxiang Lan, Min Tang, Jun Ma |
| 2024 | DAC | Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and Packages. | Shunxiang Lan, Min Tang, Liang Chen, Junfa Mao |