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Song Bai He

Publication record assembled from the DBLP archive of ranked conferences.

Papers indexed

1

Venues

1

Active years

2015–2015

Best venue rank

C

Where they publish

Papers

1 indexed papers, newest first.

YearVenueTitleAuthors
2015ICMVOptimization of deformations and hoop stresses in TSV liners to boost interconnect reliability in electronic appliances.Mary Atieno Juma, Xuliang Zhang, Song Bai He, Ahmed I. A. Abusabah