Tengwei Qiu
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2016–2016
Best venue rank
C
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2016 | HSI | Investigations of double layer UV-curing resin diamond wire saw. | Chunyan Yao, Wei Zhang, Tengwei Qiu, Minghuan Wang, Xuefeng Xu, Wei Peng |