Ting-You Lin
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2019–2019
Best venue rank
A
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2019 | DATE | Package and Chip Accelerated Aging Methods for Power MOSFET Reliability Evaluation. | Ting-You Lin, Chauchin Su, Chung-Chih Hung, Karuna Nidhi, Chily Tu, Shao-Chang Huang |