| 2017 | DAC | Incorporating the Role of Stress on Electromigration in Power Grids with Via Arrays. | Vivek Mishra, Palkesh Jain, Sravan K. Marella, Sachin S. Sapatnekar |
| 2016 | DAC | Predicting electromigration mortality under temperature and product lifetime specifications. | Vivek Mishra, Sachin S. Sapatnekar |
| 2016 | DAC | Invited - Optimizing device reliability effects at the intersection of physics, circuits, and architecture. | Deepashree Sengupta, Vivek Mishra, Sachin S. Sapatnekar |
| 2014 | ICCAD | A systematic approach for analyzing and optimizing cell-internal signal electromigration. | Gracieli Posser, Vivek Mishra, Palkesh Jain, Ricardo Reis, Sachin S. Sapatnekar |
| 2013 | DAC | The impact of electromigration in copper interconnects on power grid integrity. | Vivek Mishra, Sachin S. Sapatnekar |
| 2013 | DATE | Placement optimization of power supply pads based on locality. | Pingqiang Zhou, Vivek Mishra, Sachin S. Sapatnekar |
| 2013 | HCOMP | Lottery-Based Payment Mechanism for Microtasks. | L. Elisa Celis, Shourya Roy, Vivek Mishra |
| 2012 | ICCAD | Circuit reliability: From Physics to Architectures: Embedded tutorial paper. | Jianxin Fang, Saket Gupta, Sanjay V. Kumar, Sravan K. Marella, Vivek Mishra, Pingqiang Zhou, Sachin S. Sapatnekar |