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W. Rhett Davis

Publication record assembled from the DBLP archive of ranked conferences.

Papers indexed

11

Venues

7

Active years

2006–2024

Best venue rank

A*

Where they publish

Papers

11 indexed papers, newest first.

YearVenueTitleAuthors
2024AISTATSDE-HNN: An effective neural model for Circuit Netlist representation.Zhishang Luo, Truong Son Hy, Puoya Tabaghi, Michal Defferrard, Elahe Rezaei, Ryan Carey, W. Rhett Davis, Rajeev Jain, Yusu Wang
2021ICCADFast and Accurate PPA Modeling with Transfer Learning.W. Rhett Davis, Paul D. Franzon, Luis Francisco, Billy Huggins, Rajeev Jain
2021ISLPEDAn Instruction-Level Power and Energy Model for the Rocket Chip Generator.Zhiping Wang, W. Rhett Davis
2017ICCDH3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor.Vinesh Srinivasan, Rangeen Basu Roy Chowdhury, Elliott Forbes, Randy Widialaksono, Zhenqian Zhang, Joshua Schabel, Sungkwan Ku, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
2013ICCDRationale for a 3D heterogeneous multi-core processor.Eric Rotenberg, Brandon H. Dwiel, Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Rangeen Basu Roy Chowdhury, Nyunyi M. Tshibangu, Steve Lipa, W. Rhett Davis, Paul D. Franzon
2013ISCASExploring early design tradeoffs in 3DIC.Paul D. Franzon, Shivam Priyadarshi, Steve Lipa, W. Rhett Davis, Thorlindur Thorolfsson
2011DATEAn energy-efficient 64-QAM MIMO detector for emerging wireless standards.Nariman Moezzi Madani, Thorlindur Thorolfsson, Joseph Crop, Patrick Chiang, W. Rhett Davis
2010DATECreating 3D specific systems: Architecture, design and CAD.Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson
2008DACDesign and CAD for 3D integrated circuits.Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller
2007ISLPEDAn architecture for energy efficient sphere decoding.Ravi Jenkal, W. Rhett Davis
2006DACExploring compromises among timing, power and temperature in three-dimensional integrated circuits.Hao Hua, Christopher Mineo, Kory Schoenfliess, Ambarish M. Sule, Samson Melamed, Ravi Jenkal, W. Rhett Davis