Weijie Tong
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2025–2025
Best venue rank
A*
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | DAC | ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation. | Zeyu Sun, Weijie Tong, Xiaoning Ma, He Cao, Jianyun Liu, Zhiqiang Li, Qinzhi Xu |