Yihua Yeh
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2025–2025
Best venue rank
B
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | ASPDAC | On Awareness of Offset-Via and Teardrop in Advanced Packaging Interconnect Synthesis. | Hao-Ju Chang, Yu-Hung Chen, Hao-Wei Huang, Yihua Yeh, Hung-Ming Chen, Chien-Nan Jimmy Liu |