Yongshun Cui
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2023–2023
Best venue rank
A*
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2023 | ICSE | Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations. | Ming Yan, Junjie Chen, Hangyu Mao, Jiajun Jiang, Jianye Hao, Xingjian Li, Zhao Tian, Zhichao Chen, Dong Li, Zhangkong Xian, Yanwei Guo, Wulong Liu, Bin Wang, Yuefeng Sun, Yongshun Cui |