Yuhei Imai
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
3
Venues
1
Active years
2019–2022
Best venue rank
A*
Where they publish
Papers
3 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2022 | UIST | A bonding technique for electric circuit prototyping using conductive transfer foil and soldering iron. | Tomohito Suzuki, Yuhei Imai, Hiroyuki Manabe |
| 2021 | UIST | Single-sided Multi-layer Electric Circuit by Hot Stamping with 3D Printer. | Yuhei Imai, Hiroyuki Manabe |
| 2019 | UIST | Hot Stamping of Electric Circuits by 3D Printer. | Yuhei Imai, Kunihiro Kato, Norihisa Segawa, Hiroyuki Manabe |