Zhenming Yang
Publication record assembled from the DBLP archive of ranked conferences.
Papers indexed
1
Venues
1
Active years
2025–2025
Best venue rank
A*
Where they publish
Papers
1 indexed papers, newest first.
| Year | Venue | Title | Authors |
|---|---|---|---|
| 2025 | UIST | ProForm: Solder-Free Circuit Assembly Using Thermoforming. | Narjes Pourjafarian, Zhenming Yang, Jeffrey Ian Lipton, Benyamin Davaji, Gregory D. Abowd |