Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies.

Piotr Mackowiak, Samer Al-Magazachi, Klaus-Dieter Lang, Kolja Erbacher, Manuel Buscher, Ha-Duong Ngo, Kai Zoschke, Michael Schiffer

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