Real-Time X-Ray Inspection of 3D Defects in Circuit Board Patterns.
Hideaki Doi, Yoko Suzuki, Yasuhiko Hara, Tadashi Iida, Yasuhiro Fujishita, Koichi Karasaki
Browse the full ICCV paper archive.
Hideaki Doi, Yoko Suzuki, Yasuhiko Hara, Tadashi Iida, Yasuhiro Fujishita, Koichi Karasaki
Browse the full ICCV paper archive.